Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Thermaltronics Launches New Solder Robot to Simplify Soldering Applications
May 4, 2020 | Thermaltronics USA, Inc.Estimated reading time: Less than a minute
Thermaltronics USA, Inc. announces that it has added a new product to its solder robot range: the TMT-R8000S. The system simplifies and automates hand soldering processes with precision ballscrews, servo motors and industry-leading software.
A Thermaltronics spokesperson stated that the automation in the electronics industry is accelerating at a rapid pace and as such the new TMT-R8000S solder robot will enable companies to meet the requirements of Industry 4.0, with accuracy, repeatability and traceability, at an affordable price.
The single-head soldering robot, TMT-R8000S Solder Robot System, is designed for simplified soldering applications but still includes vision/mapping, fiducial marks and dynamic laser height control and incorporates the same IP software used on the company’s successful benchtop system. It also includes a separate drive motor, which allows for adjustment solder wire feeder, a feature under patent application.
Thermaltronics believes this system provides companies with the best option when seeking to automate their hand soldering processes. A spokesperson for Thermaltronics stated that using precision components and industry-leading software maximizes yield rates.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.