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Advanced Electronics Packaging Digest

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Neways, SRC Partner on Advanced European Defense Technology

10/20/2026 | Neways
Neways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed an agreement with SRC, Inc., a not-for-profit U.S. research and development corporation specializing in developing, manufacturing and servicing advanced defense technologies.

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Infineon Showcases AI-Era Technologies at electronica 2026

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Infleqtion UK to Develop Deployable Quantum RF Direction-Finding System

10/13/2026 | BUSINESS WIRE
Infleqtion, a global leader in quantum computing and quantum sensing powered by neutral-atom technology, has been awarded £9 million (~$12M) by Innovate UK, part of UK Research and Innovation (UKRI), to continue development of a deployable quantum radio frequency (QRF) direction finding (DF) system as part of the Quantum Missions Primer programme.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.
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