-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes
May 18, 2020 | Business WireEstimated reading time: 2 minutes
Cadence Design Systems, Inc. recently announced the availability of 56G long-reach SerDes IP on TSMC’s N7 and N6 process technologies.
Hyperscale computing continues to be the main driver for very high-speed SerDes, and 112G/56G is a key enabler for cloud data center and optical networking applications. 56G connectivity is particularly important for 5G infrastructure deployment, both in baseband and remote radio head systems. To address this broader market, Cadence has expanded its PAM4 SerDes portfolio with 56G long-reach SerDes IP on the TSMC N7 and N6 processes delivering optimized power, performance and area (PPA). For more information on the 56G long-reach PAM4 SerDes, please visit www.cadence.com/go/56GSerDes.
Cadence is ready to engage with customers immediately on 5G, compute server processor and machine learning workload-accelerator system-on-chip (SoC) design enablement. The Cadence® 56G long-reach SerDes IP delivers design excellence in support of the Cadence Intelligent System Design™ strategy, offering designers a number of benefits, including:
- Best-in-class 36db+ insertion loss using Cadence’s well-proven multi-rate DSP technology
- Industrial temperature range, CPRI data rate support and per-lane PLL are ideal for 5G applications
- 56G long-reach performance has been achieved on N7 test silicon and is compatible with the N6 process
- Fully compliant with the IEEE standard specification
- Programmable power configurations via a unique firmware-controlled adaptive power optimizer, which provides optimal power and performance tradeoffs and more efficient system designs based on platform requirements
- Optimal data recovery through the programmable DSP-based architecture, which allows optimal power delivery for a given reach and provides superior data recovery under lossy and noisy channel conditions
- Improved flexibility enabled by the extended reach capability lets customers use lower cost PCBs and achieve greater flexibility in PCB and system design
“We are pleased to see Cadence expand its PAM4 offerings to include 56G and extend support to TSMC N7 and N6 process technologies,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “This joint effort combining Cadence’s leading edge SerDes IP and TSMC’s advanced process technologies will help our customers unleash their silicon innovations for emerging 5G and hyperscale data center applications.”
“After being first to market in 2019 with silicon-proven 112G-LR SerDes on TSMC 7nm technology, we have now expanded our offering to include PPA-optimized 56G-LR to address the connectivity needs of the 5G infrastructure and AI/ML market. This new PAM4-based 56G-LR SerDes is based on Cadence’s well-proven multi-rate DSP technology,” said Rishi Chugh, vice president of product marketing, IP Group at Cadence. “The availability of Cadence’s 56G long-reach SerDes IP on the TSMC N7 and N6 processes accelerates the adoption and deployment of cost-effective 100G and 400G networks.”
Suggested Items
SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.
ITW EAE Achieves ISO 14001 Certification Across All Manufacturing Sites
01/14/2025 | ITW EAEITW EAE, the Electronic Assembly Equipment division of ITW, proudly announces that its manufacturing facilities in Camdenton, Missouri; Lakeville, Minnesota; and Suzhou, China have achieved ISO 14001 certification.
January 2025 Issue of Design007 Magazine: The Designer of the Future
01/13/2025 | I-Connect007 Editorial TeamAs we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like for the next generations?
The Shaughnessy Report: The Designer of Tomorrow
01/14/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s a great time to be a PCB designer. The job is more complex than ever, but it's also a lot of fun. We can only wonder what the PCB designers of 1975 would think about today’s typical workday. What will the designer's job look like in the future? There has been a move toward working remotely, driven partly by the COVID pandemic and partly by reality: Many experienced designers simply will not relocate, even for a more lucrative job.
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.