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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes
May 18, 2020 | Business WireEstimated reading time: 2 minutes
Cadence Design Systems, Inc. recently announced the availability of 56G long-reach SerDes IP on TSMC’s N7 and N6 process technologies.
Hyperscale computing continues to be the main driver for very high-speed SerDes, and 112G/56G is a key enabler for cloud data center and optical networking applications. 56G connectivity is particularly important for 5G infrastructure deployment, both in baseband and remote radio head systems. To address this broader market, Cadence has expanded its PAM4 SerDes portfolio with 56G long-reach SerDes IP on the TSMC N7 and N6 processes delivering optimized power, performance and area (PPA). For more information on the 56G long-reach PAM4 SerDes, please visit www.cadence.com/go/56GSerDes.
Cadence is ready to engage with customers immediately on 5G, compute server processor and machine learning workload-accelerator system-on-chip (SoC) design enablement. The Cadence® 56G long-reach SerDes IP delivers design excellence in support of the Cadence Intelligent System Design™ strategy, offering designers a number of benefits, including:
- Best-in-class 36db+ insertion loss using Cadence’s well-proven multi-rate DSP technology
- Industrial temperature range, CPRI data rate support and per-lane PLL are ideal for 5G applications
- 56G long-reach performance has been achieved on N7 test silicon and is compatible with the N6 process
- Fully compliant with the IEEE standard specification
- Programmable power configurations via a unique firmware-controlled adaptive power optimizer, which provides optimal power and performance tradeoffs and more efficient system designs based on platform requirements
- Optimal data recovery through the programmable DSP-based architecture, which allows optimal power delivery for a given reach and provides superior data recovery under lossy and noisy channel conditions
- Improved flexibility enabled by the extended reach capability lets customers use lower cost PCBs and achieve greater flexibility in PCB and system design
“We are pleased to see Cadence expand its PAM4 offerings to include 56G and extend support to TSMC N7 and N6 process technologies,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “This joint effort combining Cadence’s leading edge SerDes IP and TSMC’s advanced process technologies will help our customers unleash their silicon innovations for emerging 5G and hyperscale data center applications.”
“After being first to market in 2019 with silicon-proven 112G-LR SerDes on TSMC 7nm technology, we have now expanded our offering to include PPA-optimized 56G-LR to address the connectivity needs of the 5G infrastructure and AI/ML market. This new PAM4-based 56G-LR SerDes is based on Cadence’s well-proven multi-rate DSP technology,” said Rishi Chugh, vice president of product marketing, IP Group at Cadence. “The availability of Cadence’s 56G long-reach SerDes IP on the TSMC N7 and N6 processes accelerates the adoption and deployment of cost-effective 100G and 400G networks.”
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Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.