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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Where Is Direct Imaging Headed?

06/30/2026 | Marcy LaRont, I-Connect007
At the 2026 EIPC Summer Conference in Lithuania, Dennis Pusch, sales and business development manager for direct imaging at Schmoll Maschinen, examined the latest developments in UV light source technologies and the real-world trade-offs manufacturers must consider. If you're evaluating an imaging system upgrade or simply want to understand where the technology is headed, this interview is well worth your time.
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