Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Rehm Thermal Systems Offers Webinars on Soldering Technology in German and English
May 28, 2020 | Rehm Thermal SystemsEstimated reading time: 3 minutes
Rehm will make sure you are still very well informed in these times by providing webinars on the pros and cons of soldering with nitrogen, the ViCON system software by Rehm, vacuum soldering with condensation and contact soldering processes, as well as dryer solutions.
Register to acquire some new knowledge or refresh your existing knowledge. Let the Rehm experts bring you up to date with the state of the art in terms of expertise. You can get this update in the next few weeks: the next live webinar will take place on Thursday, 18th June. Registration for all webinars takes place by email to sales@rehm-group.com.
A brief overview of all the live webinars which are coming up in the next few weeks:
18/06/2020 - Live webinar: Pros and cons of nitrogen soldering (German)
9 AM (for Germany)
Convection soldering in a nitrogen atmosphere has definitely conquered the world since the 1990s. The advantages of soldering using nitrogen, namely, a greater process window for soldering, fewer soldering errors and the option of preventing surface oxidation, were not only popular in the “age of lead."
25/06/2020 - Live webinar: ViCON – ready for smart production (English)
9 AM (for Asia, Europe, ROW) / 3 PM (for America, Europe)
Digitalised production processes and communication between machines make modern production easier and create a very high level of transparency at the same time: with the systems by Rehm Thermal Systems, the data which is relevant to ensure a safe and stable process can be communicated from machine to machine and throughout all production areas.
Line integration, efficiency, availability and networking are key words in the industry nowadays. Software-supported production enables the user to manage complex and variable processes, maintain an overview and ensure consistent conditions.
02/07/2020 - Live webinar: Vacuum technologies (English)
9 AM (for Asia, Europe, ROW) / 3 PM (for America, Europe)
Vacuum soldering has been tried and tested for decades with contact heat and vapour phase soldering systems, and significantly reduces gas bubbles in soldered joints. What does this mean in terms of convection soldering, though, which is the most widespread and high performance soldering technique there is nowadays?
09/07/2020 - Live webinar: Vapor Phase Soldering (English)
9 AM (for Asia, Europe, ROW) / 3 PM (for America, Europe)
Our Condenso series can solder even the most difficult assemblies quickly and dependably, at temperatures up to 240°C. In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering process or as a pre-vacuum. Our systems let you adjust all parameters, such as pressure or temperature, flexibly – for the best soldering results that exactly match the requirements of your manufacturing.
16/07/2020 - Live webinar: Conformal Coating | Dispensing (English)
9 AM (for Asia, Europe, ROW) / 3 PM (for America, Europe)
The coating technology in the electronics industry continues to advance. A wide range of materials and application methods are specially adapted to the assembly to be produced. It is not easy not to lose the overview here! In our webinar we will explain to you that selection and implementation of the appropriate procedure does not have to be unnecessarily complicated. Let our experts show you how you too can achieve the perfect material application in just a few steps can.
23/07/2020 - Live webinar: Dryer solutions (English)
9 AM (for Asia, Europe, ROW) / 3 PM (for America, Europe)
Having an optimum drying process is important in electronics production. Depending on the chemicals which are used, electronic products make different demands of the reliable drying/hardening process during production. The RDS drying systems are configured individually according to the customer’s requirements. The different basic physical principles of heat transfer used here to make your drying processes as efficient as possible are shown in this webinar.
About Rehm Thermal Systems
Rehm is a technology and innovation leader in the state-of-the-art, cost-effective manufacturing of electronic assembly groups. It specialises in thermal system solutions for the electronics and photovoltaics industry. Rehm is a globally active manufacturer of reflow soldering systems using convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customised systems. We have a presence in all key growth markets and, as a partner with 30 years of industry experience, we are able to implement innovative production solutions that set new standards.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.