Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
SEHO to Demo the Modular SelectLine-C at Productronica China
June 3, 2020 | SEHO Systems China Ltd.Estimated reading time: 1 minute
SEHO Systems China Ltd., a subsidiary of SEHO Systems GmbH, announced plans to exhibit at productronica China, scheduled to take place July 3-5, 2020 at the Shanghai National Exhibition and Convention Center. The company will showcase the SelectLine-C in the German Pavilion in hall 6.1, booth #C302.
Time plays a key role in modern electronic production. With the SelectLine platform, SEHO developed a selective soldering system that features a revolutionary design. The SelectLine convinces with highest precision and solder joint quality as well as a high degree of flexibility: No change-over is required to dynamically process a variety of assemblies with short cycle times, in either mini-wave processes or multi-wave soldering processes.
The modular design of the SelectLine-C enables it to be used for standalone operation or expanded with additional modules at any time to be used inline. Modules with different dimensions can be individually configurated with fluxer, preheating, soldering units, cooling modules, selective brush system and AOI and, depending on the requirements, they may be combined to a complete manufacturing line. It is extendable up to 6 soldering units and more than 15 parallel workstations in one system.
The modular machine concept and numerous configuration possibilities allow adaptation to nearly all production requirements. Maximum throughput requirements are met with the SYNCHRO concept – patented by SEHO. The intelligent software feature coordinates the soldering process for PCBs so that the total throughput is nearly doubled without the need for significant investment. Cycle times can be reduced by nearly 50 percent in SYNCHRO operation mode.
Additionally, automatic ultrasonic cleaning of solder nozzles ensures the highest reliability and significant time savings. What previously had to be done manually and with aggressive chemicals, now is automatically and environmentally friendly performed through the machine. By automatically performing a gentle cleaning, the lifetime of the solder nozzles is extended up to several months.
Special features are the integrated additional processes. A selective brush station for automatic cleaning of particular board areas from solder residues and solder balls can be implemented after the soldering process.
A zero-fault production turns into reality with the integration of an AOI system. Here, inspection of the solder joints is made immediately after the soldering or brushing process. Assemblies that have been detected with a fault can be removed from the inline production automatically.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.