Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
Indium Corporation Features Miniaturization Products at CMM
June 11, 2020 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation will feature its portfolio of proven products for miniaturization at the China Electronics Manufacturing Automation & Resources Exhibition (CMM), July 9-11, 2020, in the town of Houjie, Dongguan, China.
Indium Corporation offers a wide portfolio of proven products that meet the evolving needs of miniaturization in mobile, automotive, and 5G infrastructure applications. From paste to wire, flux, and preforms, Indium Corporation’s products are specifically engineered to support smaller components that require precision materials, including:
- Durafuse™ LT—a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications with reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performs better than SAC305 with optimum process setup.
- PicoShot™ NC-5M—a no-clean halogen-free solder paste developed with Mycronic for their MY600 and MY700 jetting systems. Its innovative formulation provides exceptional jetting performance and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues. PicoShot™ can be used in stand-alone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield-attach, and microBGA.
- Indium12.8HF Solder Paste is a jetting and microdispensing solder paste formulated to be compatible with a wide range of microdispense and jetting systems. Inherently chemically compatible with Indium8.9HF Solder Paste, Indium12.8HF is optimized for long-term jetting and dispensing and is formulated to combat common jetting and dispensing defects, such as graping and head-in-pillow (HIP).
- Indalloy®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, it provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
- QuickSinter®silver sintering paste delivers consistent, high-speed sintering on a variety of surfaces and die metallizations. QuickSinter®works well in both high- and low-temperature pressure or pressureless applications. It can be used for discretes, small modules, and integrated power modules.
- WS-446HF flip-chip and ball-attach flux is a water-soluble, halogen-free flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, surfaces used in embedded trace substrate (ETS), and flip-chip on leadframe (FCOL). WS-446HF features an activator chemistry powerful enough to deal with a variety of metallizations, yet cleans away completely to eliminate electrical failures, such as dendrites. Its tackiness is suitable for flip-chip and ball grid array (BGA) assembly.
For more information, visit Indium Corporation’s experts at the show at booth 6006.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.