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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 26, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Updates on trade shows, conferences, and associations dominated industry news this past week. Some events are returning to a physical venue; others are opting for a virtual version in 2020. Add to that a spate of cross-association cooperative agreements and new programs for career development coming from multiple associations, and you’ve delivered four of my top five picks.
Of course, our new “Just Ask Happy” with Happy Holden project must make the list not only because it’s fun but also because it’s extremely interesting.
Next week, check the Friday edition of our Daily Newsletter for Andy Shaughnessy’s picks.
SMTA International Conference and Expo Goes Virtual
Published on June 23, 2020
For industry attendees, exhibitors, and researchers submitting papers to SMTA International, this announcement is a must-read.
Atotech to Participate in SEMICON China and CSTIC 2020
Published on June 19, 2020
As if Atotech’s news wasn’t reason enough to include in my picks, the fact that Atotech is showing at two China shows seals the deal. While we still have a ways to go, news like this points the way to a return to normal. SEMICON and CSTIC 2020 are delivering physical venue shows. Best of luck to Atotech, SEMICON, and CSTIC 2020.
New Opportunity for Managers Announced, Special Attention to ‘Emerging Managers’
Published on June 19, 2020
Management is a skill. A technical team can thrive with the careful assistance of a manager who knows how to lead, navigate the management structure when facing obstacles, and when to simply get out of their team’s way. To have IPC focus on Emerging Engineers and now Emerging Managers is big news.
IPC and Automotive Industry Action Group Enhance Partnership Agreement
Published on June 22, 2020
With industry sources projecting that over 50% of the componentry of an automobile will be electronics in the near future, automobiles and automobile design need to look at the auto in very different ways. Quoting from the press release, “IPC and AIAG agreed to work closely in the areas of thought leadership, quality and supply chain best practices, and community awareness building. Together, the industry associations will educate the automotive supply chain on compliance requirements, evaluate how IPC standards and AIAG guidelines align and impact both industries, and work together to identify training that builds on professional standards.”
Just Ask Happy: Routing BGAs With High-Speed Diff Pairs
Published on June 25, 2020
This past week, we’ve been encouraging readers to pose a PCB-related question to Happy Holden, a pioneer in high-density printed circuit fabrication techniques. Boy, did you have questions! Happy has been cheerfully compiling answers, and we’ll periodically bring his answers to the newsletter. To submit your own question for Happy Holden, take the survey by clicking here. Then, bookmark the page so you can ask Happy a question any time!
Suggested Items
Advocacy: There’s No Time to Waste
05/21/2024 | Marcy LaRont, PCB007 MagazineIn the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
05/21/2024 | Real Time with...IPC APEX EXPODevan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
TPCA Releases Guide to Help PCB Industry Achieve Low-Carbon Transformation
05/21/2024 | TPCAThe introduction of EU carbon tariffs, international brands committing to carbon neutrality, and the upcoming carbon fee in Taiwan means that carbon reduction is no longer just a slogan. Domestic and international pressures have turned carbon reduction into the golden grail of corporate sustainability.
SEMICON Europa 2024 Call for Abstracts Opens
05/21/2024 | SEMISEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.
American Standard Circuits/ASC Sunstone Circuits Showcase Cutting-edge Technology at PCB East 2024
05/21/2024 | American Standard CircuitsAmerican Standard Circuits (ASC) and ASC Sunstone Circuits are excited to announce their participation in PCB East 2024, a premier event for the printed circuit board and electronics design industry. The event will take place from June 4-6, 2024, at the Boxboro Regency Hotel and Conference Center in Boxborough, MA.