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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 3, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. As H. Ross Perot predicted when I was a few years out of college, the U.S. lived to regret signing the North American Free Trade Agreement, and the new USMCA is designed to right NAFTA’s wrongs.
We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.
With all of the craziness around—some states opening up and others clamping down again due to rising COVID-19 numbers—the innovation in PCB design and manufacturing continues. Next week, check the Friday edition of our Daily Newsletter for Nolan Johnson’s picks.
IPC: Shawn DuBravac and Chris Mitchell on USMCA
Published July 2
On July 1, the USMCA trade act was phased in, and that same day, Nolan Johnson interviewed two IPC experts in that field: Chief Economist Shawn DuBravac and VP of Global Government Affairs Chris Mitchell. This is a can’t-miss interview for everyone involved in the electronics industry.
Foundations of the Future: Student Representative on the IPC Board of Directors
Published June 30
For years, IPC has been spearheading the drive to attract more young people into electronics manufacturing. As Charlene Gunter du Plessis explains, IPC has elected Paige Fiet, president of an IPC Student Chapter at Michigan Technological University, as its first Board of Directors Student Member Liaison. We have to reach more young people, and the best way to reach them is with other young people who are already involved in the industry. Smart move by IPC.
Materials for Automotive Applications: Thermal Management Issues
Published July 2
It’s summertime, and it’s getting hot! Technical Editor Pete Starkey attended the recent HDP User Group Automotive Technology Webinar, and he was particularly impressed with a presentation on thermal management given by Ventec International Group’s Alun Morgan. As Pete comments, thermal challenges are becoming part of even mainstream automotive applications, and insulated metal substrates provide cost-effective options.
June Issue of SMT007: A Snapshot of a Resilient Industry
Published June 30
We recently asked Tamara Jovanovic, a young hardware engineer with smart baby-bed maker Happiest Baby, to review the June issue of SMT007 Magazine. Tamara discusses the articles on leadership in these COVID-19 times and weaves in personal stories, such as roommates who dubbed her a “ghostbuster” when she brought her oscilloscope home to work remotely. Don’t miss this.
Just Ask Happy: Stacked Microvia Reliability Issues
Published July 1
Our “Just Ask Happy” series is the gift that keeps on giving. Happy Holden enjoys answering your questions, and, as befits someone known as “Mr. HDI,” he gets plenty of questions on microvias. In this article, Happy addresses the ongoing reliability challenges related to stacking vias and a few workarounds to use until this problem is solved. If you have a question for Happy, click here.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.