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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.

Indium to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia

08/24/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China.

Indium Opens New Manufacturing Facility in Guadalajara, Mexico, Expanding Global Production Network

08/11/2026 | Indium Corporation
Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications, announced the opening of a new manufacturing facility in Guadalajara, Mexico.

SMTA Next Gen 10 Emerging Leaders Announced

07/01/2026 | SMTA
The SMTA is proud to announce the Next Gen 10 award recipients for 2026. SMTA’s Next Gen 10 program recognizes young leaders who are shaping the future of electronics manufacturing through technical innovation, leadership, and service to the industry.

SIA Applauds CHIPS Act Incentives for Coherent

06/18/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding manufacturing incentives announced by the Commerce Department and Coherent to support the expansion of Coherent’s indium phosphide manufacturing facility in Sherman, Texas.
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