-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Attendance Soaring for 2020 Design Automation Conference
July 31, 2020 | Business WireEstimated reading time: 1 minute
Total conference attendance at the 2020 Design Automation Conference (DAC), the industry’s premier event dedicated to the design and design automation of electronic circuits and systems, leapt by 52% compared to DAC 2019, according to the 57th DAC Executive Committee (EC).
The intense engagement at the 57th DAC, held for the first time virtually due to the recent pandemic, reflected a voracious appetite among engineers for information and insights to propel design innovation. Submissions to DAC’s research track increased by 20% in the past two years, and the Designer, IP and Embedded Tracks submissions increased by 15% compared to 2019, continuing a steady three-year rise.
The global reach of DAC, July 19 - 24, soared at the 2020 virtual event with attendance from the following regions: 24% Asia Pac, 11% Europe, 52% United States and 13% a combination of Canada, South America and Middle East.
Despite the economic and social disruption caused by the pandemic, design innovation never sleeps,” said Zhuo Li, General Chair of the 57th DAC. “We had record attendance viewing each of the four Keynotes, plus attendees globally were able to view the recorded technical sessions at their leisure in their respected time-zones. The rise in submissions across all tracks proves the electronic design ecosystem is thriving and expanding in this particularly challenging time for all of us world-wide.”
Engagement with technical content exceeded expectations at the virtual event in all tracks and independent sessions. The content expanded across all aspects of the electronic design ecosystem from electronic design automation (EDA), embedded systems, security and privacy, IP, AI/machine learning, and autonomous systems.
Total number of sessions and programs at the DAC 2020 virtual event:
- 416 Recorded technical session videos
- (Research, Designer, IP, Embedded Systems & Software Tracks plus RISC-V and Design on Cloud presentations)
- 449 PDF Papers/Posters
- 9 Live research panels
- 17 Live tutorial sessions
- 40 Live Ph.D Forum presentations
- 41 Live DAC Young Fellow sessions
- 2 Live “Meet the Award Winner” sessions
- 1 Live Accellera lunch and learn technical panel
- 10 Live virtual happy hours
Preliminary attendance figures for the 57th DAC are follows:
- Conference attendees – 2,383
- I Love DAC - 3,338
- Exhibitors’ booth staff – 408
Total attendees as of Monday, July 27: 6,129
Registration is currently open with on-demand access for all registered attendees to the pre-recorded 57th DAC program through August 1, 2020. Keynotes, SKYtalks, Tech Talks and exhibitor content will be accessible through September 1, 2020 for all pre-registered attendees. For more information on the Design Automation Conference please visit www.dac.com.
Suggested Items
SEMI, IESA Join to Strengthen Semiconductor Ecosystem at SEMICON India 2024
09/12/2024 | SEMIIn a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India.
Zuken Introduces Harness Builder 2025 for E3.series with Enhanced Integration and Documentation Capabilities
09/11/2024 | ZukenZuken, a global leader in electrical and electronic digital engineering solutions, is proud to unveil the 2025 version of its industry-leading Harness Builder for E3.series software.
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
09/11/2024 | StratEdgeStratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.