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Suggested Items

Elementary, Mr. Watson: The ‘Baton’ Handoff Makes or Breaks the Design

09/03/2026 | John Watson -- Column: Elementary, Mr. Watson
In my previous column in I-Connect007 Magazine, I shared the example of the U.S. men’s 4x100-meter relay team at the Tokyo 2020 Olympics. Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie were among the fastest sprinters in the world. Reaching the final seemed almost certain. Instead, they finished sixth in their qualifying heat and missed advancing by only two-hundredths of a second. The problem was not speed, experience, or talent. It occurred during the baton exchange. Their failure demonstrated that being exceptional at an individual role does not guarantee collective success. A race can be lost not during the individual legs, but during the brief moments when responsibility changes hands.

Designers Notebook: Implementing Strategic Planning Principles for PCB Design

09/03/2026 | Vern Solberg -- Column: Designer's Notebook
Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).

Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort

09/01/2026 | Joe Fjelstad -- Column: Flexible Thinking
The concept of co-designing PCBs by incorporating input from all areas of manufacturing has grown significantly over the past several years, bringing a sharper focus on the early contributors to a collaborative electronic system. From those pioneers, we have learned that the PCB is no longer simply the platform on which a design is manifested; it is now an active part of the electrical, thermal, mechanical, and economic architecture of the product. As operating frequencies rise, component pitches shrink, power densities increase, and product schedules tighten, decisions made by one discipline can no longer be isolated from the consequences they create for others.

Foxconn Earns LEED Gold, Cuts Energy Costs 50% and Water Use 40%

08/31/2026 | Foxconn
Foxconn Technology Group, the world's largest electronics manufacturer and service provider, announced that its "Ho-Fai New Energy Project," located at its battery cell R&D and pilot production center in Kaohsiung City, has officially obtained LEED BD+C v4 Gold certification.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.
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