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Creative Materials Launches New Insulating Adhesive
August 10, 2020 | Creative Materials, Inc.Estimated reading time: Less than a minute

Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive. This product is designed for assembling heat sensitive components on printed circuit boards, and it develops strong adhesive bonds and excellent thermal transfer. 813-76 provides high impact bonds that improve heat transfer while maintaining electrical insulation. It bonds to a wide variety of surfaces, has a low coefficient of expansion, and provides excellent resistance to mismatched substrates. The product is also highly chemical resistant, shows very low shrinkage, and passes the NASA outgassing requirement (ASTM-E-595).
Creative Materials designs, develops, and custom manufactures specialty electronic inks and adhesives. The company holds both ISO9001 and ISO14001 certifications. All products are manufactured in the USA.
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Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.