Got a Question? Just Ask Joe!
August 20, 2020 | I-Connect007 Research TeamEstimated reading time: 1 minute

A few months ago, we launched our “Just Ask” series with Happy Holden. Many readers took us up on it, sending all manner of questions for happy to answer.
Now, Joe Fjelstad—inventor, technologist, author, and Flex007 columnist—is getting in on the action. Here’s your chance to pick Joe’s brain. What’s the one question about this industry that you’ve always wanted to ask Joe?
Joe has spent decades working with interconnect and packaging technology, as a chemist and process engineer. He’s the pioneer behind the Occam process for solderless assembly. He often begins his columns with a quote from Lewis Carroll or Don Miguel Ruiz. Joe has also written about the need for technology companies in the Western world to develop products that help improve the lives of the poor in third-world nations.Jo
What do you want to know? Just ask Joe! If he doesn’t know the answer, he’ll talk to someone who does. To submit your questions to Joe, click here.
Joe Fjelstad is founder and CEO of Verdant Electronics and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. To read past "Flexible Thinking" columns or contact Fjelstad, click here. Download your free copy of Fjelstad’s book Flexible Circuit Technology, 4th Edition, and watch the micro webinar series on flexible circuit technology.
Suggested Items
The World's Smallest PPG Sensor Head
04/04/2025 | BUSINESS WIRESCIVAX Corporation and TSLC Corporation, a SemiLEDs Corporation wholly owned company announced that SCIVAX+TSLC have developed the world's smallest PPG (PhotoPlethysmoGraphy)* sensor head, which will be presented at the display related technology exhibition ”Touch Taiwan” to be held in Taipei, Taiwan from April 16 to 18, 2025. The samples of the PPG sensor head for evaluation will begin in April 2025.
Qualcomm Expands Generative AI Capabilities With Acquisition of VinAI Division
04/03/2025 | Qualcomm Technologies, Inc.Qualcomm announced the acquisition of MovianAI Artificial Intelligence (AI) Application and Research JSC (MovianAI), the former generative AI division of VinAI Application and Research JSC (VinAI) and a part of the Vingroup ecosystem.
Meyer Burger, OGT Solar Sign Module Supply Agreement for Italy
04/02/2025 | Meyer BurgerMeyer Burger Technology AG and OGT Solar have signed a supply agreement. The high-performance modules “Made in Germany” were manufactured at the Freiberg plant in Germany and are intended for the Italian market.
KYZEN Focuses on Concentration Monitoring and Stencil Cleaning at SMTA Arizona
04/02/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Arizona Expo and Tech Forum scheduled to take place Wednesday, April 16 at the DoubleTree by Hilton in Mesa, AZ.
Qualcomm Expands Generative AI Capabilities With Acquisition of VinAI Division
04/02/2025 | Qualcomm Technologies, Inc.Qualcomm announced the acquisition of MovianAI Artificial Intelligence (AI) Application and Research JSC (MovianAI), the former generative AI division of VinAI Application and Research JSC (VinAI) and a part of the Vingroup ecosystem.