Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Mentor Hosts Design Tool for Rigid-Flex Circuits Webinar
August 20, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
“What Technology Should Your PCB Tool Have To Design Rigid-flex Circuits Properly?” is the topic for a webinar hosted by Mentor, A Siemens Business, from 2 to 3 p.m. EDT, Tuesday, Aug. 25.
Today, electronic design companies are meeting consumer form-factor demands and ensure high reliability and flexibility in design options for products using flex/rigid-flex circuits. Designing these rigid-flex PCB’s requires a design tool with advanced technologies distinctly unique to flex/rigid-flex design. From flex/rigid-flex centric operations and capabilities that understand the unique structures, constraints, plane management, materials, stack-ups, and beyond, PADS Professional has the features and operations necessary to support flex/rigid-flex design that other tools don’t.
Presenters are Brent Klingforth, a technical marketing engineer specializing in schematic, PCB and manufacturing products; and John McMillan, technical marketing engineering manager.
You will learn:
- Requirements for Flex design
- Where arced and rounded structures are required
- How to design a proper stack-up
- Intelligent overlapping flex regions
- Automation specific to Flex design
- Proper design technique for flexible circuits
- How to incorporate Flex and Rigid-Flex designs into your product
- Automated features allowing you to dramatically reduce design time
Visit pads.com to register.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.