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Beat the Heat With New Book on Thermal Management Design Processes
September 15, 2020 | I-Connect007Estimated reading time: 1 minute
Learn how to beat the heat in your designs with The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective—the latest title in our educational library. The Printed Circuit Designer’s Guide to… series is specifically dedicated to educating PCB designers and serves as a valuable resource for people seeking the most relevant design information available.
Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.
Written by Anaya Vardya, president and CEO of American Standard Circuits, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.
Denis Boulanger, principal manufacturing engineer at Raytheon Technologies, says, "This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier."
PCB designers and design engineers, both new and veteran, will gain a thorough understanding of thermal management design processes.
Download your free copy today! You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.
We hope you enjoy The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”