The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Free Webinar Series on How to Implement Digital Twin Best Practices
September 11, 2020 | I-Connect007Estimated reading time: 1 minute
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing.” Each of the 12 segments can be viewed in about five minutes.
Have you ever wondered what digital twin is, how it's used, and its benefits? Are you interested in learning ways to optimize and streamline data flows from design, production planning, process engineering, and manufacturing? Then this micro webinar series is for you!
Expert Jay Gorajia from Siemens Industries Software has worked with hundreds of design and manufacturing organizations around the world, driving real improvements in cost, throughput, and quality over his 27 years in the industry. Viewers will learn how best to optimize throughput, cost, and quality as organizations embark on the digitalization journey.
In this 12-part series, Jay describes how to leverage the digital twin concept—from design to production planning and process engineering—through manufacturing execution and supply chain. The goal of the series is to define a blueprint for organizations seeking to digitalize and optimize their design to manufacturing processes and manufacturing operations.
The entire digital twin webinar series can be viewed in just over an hour and covers a comprehensive range of hot topics, including insights from manufacturing to improve and optimize future designs, as well as how to digitalize our factory to optimize even further.
Got five minutes? Click here and start watching “Implementing Digital Twin Best Practices From Design Through Manufacturing” today.
I-007eBooks and I-007e Micro Webinars: Your premier educational resource for circuit board design, manufacture, and assembly. I-Connect007 takes the on-demand webinar to a new level. A perfect companion to our I-007eBook series, these bite-sized webinars are available for free viewing exclusively at I-Connect007.
Additional Resources
- “Lean Digital Thread” column series by Sagi Reuven from Siemens Digital Industries
- “The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age” free eBook by Oren Manor from Mentor, a Siemens Business
Share on:
Suggested Items
Delta Electronics, Cal-Comp Strengthen Partnership to Drive Innovation in Industrial Automation
12/25/2024 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions, and Cal-Comp Electronics (Thailand) Public Company Limited (SET Ticker: CCET), a leading industry 4.0+ electronics manufacturing services (EMS) provider, have signed a Memorandum of Understanding (MOU) to deepen their collaboration in industrial automation.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Delta Honored as Top 10 Best Taiwan Global Brands
12/23/2024 | Delta ElectronicsDelta, a global leader in power management and a provider of IoT-based smart green solutions, was selected as one of the “2024 Best Taiwan Global Brands” for the 14th year in a row, ranking among Taiwan's top 10 global brands.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.