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Advanced Electronics Packaging Digest

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Genie Space Edge Processor Achieves Space Heritage with Successful U.S. Space Force Mission

08/26/2026 | PRNewswire
Ibeos, a Trident Systems company, announced that its Genie Space Edge Processor has successfully achieved space heritage following its operation during U.S. Space Force Victus Haze mission performing flawlessly.

Standard of Excellence: ‘Quality’ Is Your Company's Greatest Competitive Advantage

08/26/2026 | Anaya Vardya -- Column: Standard of Excellence
Quality has often been viewed as the final checkpoint before a product is shipped to a customer. Manufacturing organizations invest heavily in inspection teams whose responsibility is to identify defects before they escape into the marketplace. While that approach has served our industry reasonably well for many years, today's manufacturing environment demands something fundamentally different.

MKS to Showcase Advanced PCB Technologies at THECA 2026

08/24/2026 | MKS Inc.
During the conference, MKS experts will present two technical presentations addressing closed-loop digital process control and the evolving PCB technology requirements of AI, high-performance computing and data center infrastructure.

Indium to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia

08/24/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China.

Qnity Advances Node Materials Innovation with KLA Inspection Technology

08/20/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation.
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