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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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San Francisco Circuits Achieves CMMC Level 2 Certification

05/22/2026 | San Francisco Circuits
San Francisco Circuits, Inc., a leading printed circuit board fabrication and assembly supplier serving commercial and defense markets, announced that it has achieved Final Cybersecurity Maturity Model Certification (CMMC) Level 2 status following a successful independent assessment by an accredited Certified Third-Party Assessment Organization (C3PAO).

Global Electronics Association Launches Global Electronics Policy Council to Unite Industry on Trade, Investment, and Supply Chain Policy

05/20/2026 | Global Electronics Association
The Global Electronics Association announced the formation of the Global Electronics Policy Council (GEPC), a new body uniting leading electronics companies from around the world to advance a coordinated policy agenda across every major region of the electronics supply chain.

SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding

05/14/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.

Lockheed Martin Wins Navy Contract for PAC-3 MSE Aegis Integration

04/23/2026 | Lockheed Martin
The U.S. government announced a contract with Lockheed Martin for the development, integration and testing of PAC-3® Missile Segment Enhancement (MSE) into the Aegis Combat System.

Lockheed Martin Secures First Contract for PAC-3® MSE Accelerated Production

04/10/2026 | Lockheed Martin
The U.S. government awarded Lockheed Martin a multibillion-dollar contract to continue critical accelerated production of PAC-3 Missile Segment Enhancement (MSE).
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