Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
I-Connect007 Columnist Jennie S. Hwang to Speak at Upcoming Conferences, Appointed to Military Board
September 15, 2020 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Dr. Jennie S. Hwang will deliver a professional development course on “Preventing Manufacturing Defects and Product Failure” at the virtual SMTAI conference on October 5 (11:30 a.m.–3:00 p.m.). For more information, click here.
Dr. Hwang will also deliver two courses at the virtual IMAPS International Microelectronics and Packaging Symposium on October 7 (3:00–5:00 p.m.) and October 8 (1:00–3:00 p.m.) on “Packaging/Board Integrity and Solder Joint Reliability” and “Prevent Product Failure: Tin Whisker and Intermetallic Compounds,” respectively.
For more information:
Further, Dr. Hwang was recently appointed to the Board on Army RDT&E, Systems Acquisition, and Logistics (BARSL), which was recently established to advise the Assistant Secretary of the Army for Acquisition, Logistics, and Technology (ASA[ALT]), the U.S. Department of Defense, on national security, engineering, technological, operational, management, and logistical issues.
The Board focuses on helping the operations of the nation’s primary land force and the Joint Force maintain overmatch against adversaries by deploying the most advanced capabilities and embracing advanced artificial intelligence, autonomy, big data analytics, hardened network across all operating domains and in cyberspace, electronic warfare and the electromagnetic spectrum.
Concurrently, Dr. Hwang continues to serve as the Chairman of both the Assessment Board of Army Research Laboratory and the Army Research Program Review and Analysis Committee. She also serves on the Committee on Technical Programs of the National Institute of Standards and Technology of the Department of Commerce and the National Laboratory Assessments Board.
To read Dr. Hwang's SMT columns, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.