Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
I-Connect007 Columnist Jennie S. Hwang to Speak at Upcoming Conferences, Appointed to Military Board
September 15, 2020 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Dr. Jennie S. Hwang will deliver a professional development course on “Preventing Manufacturing Defects and Product Failure” at the virtual SMTAI conference on October 5 (11:30 a.m.–3:00 p.m.). For more information, click here.
Dr. Hwang will also deliver two courses at the virtual IMAPS International Microelectronics and Packaging Symposium on October 7 (3:00–5:00 p.m.) and October 8 (1:00–3:00 p.m.) on “Packaging/Board Integrity and Solder Joint Reliability” and “Prevent Product Failure: Tin Whisker and Intermetallic Compounds,” respectively.
For more information:
Further, Dr. Hwang was recently appointed to the Board on Army RDT&E, Systems Acquisition, and Logistics (BARSL), which was recently established to advise the Assistant Secretary of the Army for Acquisition, Logistics, and Technology (ASA[ALT]), the U.S. Department of Defense, on national security, engineering, technological, operational, management, and logistical issues.
The Board focuses on helping the operations of the nation’s primary land force and the Joint Force maintain overmatch against adversaries by deploying the most advanced capabilities and embracing advanced artificial intelligence, autonomy, big data analytics, hardened network across all operating domains and in cyberspace, electronic warfare and the electromagnetic spectrum.
Concurrently, Dr. Hwang continues to serve as the Chairman of both the Assessment Board of Army Research Laboratory and the Army Research Program Review and Analysis Committee. She also serves on the Committee on Technical Programs of the National Institute of Standards and Technology of the Department of Commerce and the National Laboratory Assessments Board.
To read Dr. Hwang's SMT columns, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.