Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields
September 16, 2020 | Real Time with...SMTAIEstimated reading time: 7 minutes
Johnson: Product available as of?
Forsythe: The product is in the market now. It was introduced in the fall, I believe. We are in the fall. It’s the pandemic. I can’t even remember what time of year it is. My goodness.
Johnson: It’s true of us all.
Forsythe: It was introduced a bit earlier this year, and it is available. It has been in field trials and that sort of stuff for an extended period of time, but it has only been in common routine availability for the last few months. And we’re having some good success with it. We’re really excited about it.
Johnson: Great. Early customer feedback?
Forsythe: It has been very positive. They like the simplicity. They like the effectiveness and the fact that it’s a newer product, so things like health and safety and all that sort of stuff are up to the current standards. The older products were safe and totally reasonable for their day, but we live in a world where that was then, and this is now. And particularly on the health and safety side, people are always striving to hit a higher standard, and that’s what this new product helps them achieve.
Johnson: Are there any other things that we need to talk about with regard to E5631 before we wrap up, Tom?
Forsythe: It fits into the whole KYZEN portfolio of top of the line products that help meet people’s emerging needs. Our Aquanox A4727 leads the way on the aqueous cleaning side—more common for products and assemblies, both batch and conveyor. And it just fits right in there with modern state-of-the-art products that are designed after years of research and exhaustive field testing to meet people’s needs and expectations today.
Johnson: Great. Tom, thanks for taking the time virtually, from our respective offices, to have this conversation. It’s going to be the theme of the whole show, I’m sure. But I really appreciate you taking the time.
Forsythe: My pleasure. And thank you for taking the time as well. And everybody stay safe out there. But please do virtually dial into SMTAI. We’re all looking forward to it.
Johnson: For Real Time with…SMTAI, I’m Nolan Johnson. Thanks for watching.
Page 2 of 2
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.