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National Circuit Assembly Offers Authentic Measurement and Inspection with New 3D SPI System
September 18, 2020 | National Circuit AssemblyEstimated reading time: Less than a minute

National Circuit Assembly, a provider of PCB, cable and electro/mechanical manufacturing and test services to leading OEMs, has purchased and installed a PARMI HS60L 3D Solder Paste Inspection (SPI) system. With the most reliable and accurate 3D data, NCA offers reliable, accurate inspection.
“Introducing this automated SPI machine into our production lines will have a tremendous impact on our efficiency and quality control,” says Eric Nguyen, NCA VP Manufacturing. “Rather than relying on possible human error to inspect the quality of our solder paste placement, we can lower lead times and promise higher success rates across the board through a more accurate, automated process.”
PARMI’s intelligent vision algorithm applied to the high-quality 3D data detects every type of solder paste defect, which translates to zero false calls for NCA. The measurable items are height, area, volume and positional offset that deviate from tolerance limits.
The remarkable design concept of the HS60L, including rotating laser sheet beam against the scan direction and maintaining the small angle between the laser sheet beam and camera optical axis, ensures high performance, repeatability and accuracy.
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Rachael Temple - AlltematedSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.