The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
National Circuit Assembly Offers Authentic Measurement and Inspection with New 3D SPI System
September 18, 2020 | National Circuit AssemblyEstimated reading time: Less than a minute
National Circuit Assembly, a provider of PCB, cable and electro/mechanical manufacturing and test services to leading OEMs, has purchased and installed a PARMI HS60L 3D Solder Paste Inspection (SPI) system. With the most reliable and accurate 3D data, NCA offers reliable, accurate inspection.
“Introducing this automated SPI machine into our production lines will have a tremendous impact on our efficiency and quality control,” says Eric Nguyen, NCA VP Manufacturing. “Rather than relying on possible human error to inspect the quality of our solder paste placement, we can lower lead times and promise higher success rates across the board through a more accurate, automated process.”
PARMI’s intelligent vision algorithm applied to the high-quality 3D data detects every type of solder paste defect, which translates to zero false calls for NCA. The measurable items are height, area, volume and positional offset that deviate from tolerance limits.
The remarkable design concept of the HS60L, including rotating laser sheet beam against the scan direction and maintaining the small angle between the laser sheet beam and camera optical axis, ensures high performance, repeatability and accuracy.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.