Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
AQS, Inc. Improves Selective Solder Capability
September 18, 2020 | AQS, Inc.Estimated reading time: Less than a minute
AQS, Inc., a state-of-the-art EMS provider located in Silicon Valley, is pleased to announce that it has purchased a Novo® 103 Selective Soldering platform from SELECT Products, part of Nordson ELECTRONICS SOLUTIONS.
Bruce Lee, VP of Operations, commented, “AQS’ HQ in Fremont, Silicon Valley is a hands-on showcase of our broad range of world-class capabilities. We’re working with customers who bring us innovative new product ideas. We help bring those ideas into production with a best in cost, best in quality solution in the right market window.”
The Novo® 103 is a robust selective soldering platform delivering an exceptional combination of versatility, productivity and value. The system has many unique features, including high speed Z-axis motion for faster processing time and reduced soldering cycle.
With the purchase, AQS can perform selective soldering of printed circuit boards as large as 610 x 457 mm (24.0 x 18.0 in.) The standalone platform is ideal for prototype, cell manufacturing or batch production requirements.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.