Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
National Circuit Assembly Acquires High-Speed Multi-Angle 3D AOI System
September 21, 2020 | National Circuit AssemblyEstimated reading time: 1 minute
National Circuit Assembly, a provider of PCB, cable and electro/mechanical manufacturing and test services to leading OEMs, is pleased to announce that it has purchased a Test Research, Inc. (TRI) TR7500 SIII 3D AOI system to add to its established range of AOI machines. TRI’s optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible.
“Quality control is one of the most important parts of our operations and our dedication to improving this area is shown by the purchase of this new technology,” says Eric Nguyen, NCA VP Manufacturing. “Solving problems before they get out of control and being proactive are very important to us, and this AOI machine allows us to work more efficiently both in cost and time.”
Combining state-of-the-art software and a third-generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection with high inspection coverage and easy programming. Installed in NCA’s Garland facility, the system enables the company to perform high-speed color multi-angle inspection of up to 01005 components and high defect coverage using hybrid 2D+3D inspection technology. With the purchase of this machine, each of NCA’s SMT production lines has a complete range of quality control measurements to ensure high-quality, on-time delivery to customers.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.