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National Circuit Assembly Acquires High-Speed Multi-Angle 3D AOI System
September 21, 2020 | National Circuit AssemblyEstimated reading time: 1 minute
National Circuit Assembly, a provider of PCB, cable and electro/mechanical manufacturing and test services to leading OEMs, is pleased to announce that it has purchased a Test Research, Inc. (TRI) TR7500 SIII 3D AOI system to add to its established range of AOI machines. TRI’s optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible.
“Quality control is one of the most important parts of our operations and our dedication to improving this area is shown by the purchase of this new technology,” says Eric Nguyen, NCA VP Manufacturing. “Solving problems before they get out of control and being proactive are very important to us, and this AOI machine allows us to work more efficiently both in cost and time.”
Combining state-of-the-art software and a third-generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection with high inspection coverage and easy programming. Installed in NCA’s Garland facility, the system enables the company to perform high-speed color multi-angle inspection of up to 01005 components and high defect coverage using hybrid 2D+3D inspection technology. With the purchase of this machine, each of NCA’s SMT production lines has a complete range of quality control measurements to ensure high-quality, on-time delivery to customers.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.