Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Insituware to Award Six $100 Amazon Gift Cards during SMTAI
September 23, 2020 | Insituware LLCEstimated reading time: 1 minute
Insituware LLC, the developer of the first smart measurement solution for quality control of materials, is giving away six $100 Amazon gift cards during their live demos at the SMTA International virtual event.
Each day of the show (September 28, 29, and 30), Insituware will host live demos in their virtual booth to showcase the Vision MARK-1, a revolutionary hand-held tool that can help you detect and diagnose defects in solder paste within minutes right on the shop floor, reducing costly mistakes and preventing manufacturing delays.
The demos will be at 10AM EST (9AM CST) and 2PM EST (1PM CST) each day. During each live demo, the presenter will say a key word. Attendees can then ‘enter’ the drawing by going to www.insituware.com/contact and filling out the contact form with the subject line “SMTAI Amazon Gift Card” and writing the key word in the body of the email.
The lucky winners will be contacted when the SMTA International virtual event has concluded.
To read more about the SMTA International virtual event and register for free as an attendee, visit smta.org.
Insituware is revolutionizing the way we control materials quality in electronics manufacturing! For more information, visit insituware.com.
About Insituware LLC
Insituware is an innovative technology company developing novel products to measure materials in the electronics manufacturing industry. Driven by advanced analytical sensors, smart devices, and intelligent cloud-based information, these revolutionary hand-held tools enable rapid, real-time inspection to improve material quality control, increase efficiency, and lower cost.
To learn more about Insituware, check out their Real Time with...SMTAI 2020 Interview.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.