-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ASM Opens Up New Possibilities in High-Volume Solder Paste Printing
September 24, 2020 | ASM Assembly SystemsEstimated reading time: 2 minutes
With an update, technology leader ASM presents additional functions for its high-volume DEK TQ printer, which sets new records in terms of speed, floor space performance and wet-printing accuracy. With its perfectly matched combination of print head, paste dispenser and innovative understencil cleaning system, the DEK TQ can operate for up to 8 hours without an operator assist. With its new hardware and software options, the printer features even more capabilities now. The innovations comprise its offline programming, the DEK TQ V1 operating software, the High Flow Vacuum board support system, and the intelligent and flexible verification and traceability functions.
With new options and software enhancements, technology leader ASM further improves the operability and capabilities of its DEK TQ stencil printer. The High Flow Vacuum function, for example, provides an affordable and highly efficient board support solution for the high-volume production of small and highly complex PCBs.
The new and highly flexible and intelligent verification function allows the verification of all printer materials either by means of the ASM OIB, with an interface to a higher-level MES (ideal for testing and releasing the solder paste) or individually selectable against a reference on the DEK TQ for supports, squeegees, etc.
Together with the sophisticated traceability functions, this provides an ideal connection of the DEK TQ to the Smart Factory.
New software
The DEK V1 station software and SIPLACE Pro have been revised from the ground up. With ASM Printer Programming and its integration into SIPLACE Pro, central program management is being raised to a new level. Printing programs are now administered across lines, printing and placement programs downloaded jointly to SMT lines, and each printer’s features are verified automatically before a program is executed.
DEK TQ – the standard for high-volume production
The DEK TQ sets new standards in performance, efficiency and precision. In a footprint of only 1.3 by 1.0 meters, the high-volume printer achieves a core cycle time of as little as five seconds for maximum throughput. With its use of precise linear drives, off-belt printing, innovative clamping systems and an advanced print head, the DEK TQ achieves a wet-printing accuracy of ±17.5 µm @ 2 Cpk – more than enough to reliably print the pads for 0201 metric components and modern ultra-fine-pitch applications. Each machine comes with an external capability certification. Open interfaces like IPC-Hermes-9852, Closed-Loop-to-SPI, ASM OIB and IPC CFX make it easy to integrate the DEK TQ into a smart integrated factory. They also deliver additional investment protection. With its highly efficient understencil cleaning system featuring an extra-large fabric roll and additional tanks as well as its automatic print head and dispenser system, the printer can run for up to 8 hours with no operator assist.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.