Nolan’s Notes: Looking Deep Into the Future With X-ray
Knocking Down the Bone Pile: Basics of Component Lead Tinning
Standard of Excellence: Anticipating Customer Needs Early and Often
KIC’s Karl Pfluke to Present During SMTAI Virtual Conference
September 25, 2020 | KICEstimated reading time: 1 minute
KIC is pleased to announce that Karl Pfluke, Sales Manager – US/Canada, will present “Automatic Reflow Profiling and Data Analytics” during the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 and the On-Demand Conference & Expo will take place Sept. 28-Oct. 23, 2020.
Pfluke will provide an overview of how an Automatic Reflow Profiling System (Reflow Process Inspection) can be used in a factory for verifying reflow oven capabilities, how this is used for quality improvement and ultimately process control to circumvent field failures. The paper will describe what automatic profiling is, show what data can be collected and the available analytics and why these are used to achieve the goals of process and quality control.
Pfluke stated, “Without having an automatic profiling system, there really is no way of knowing how the oven is performing or if every board reflowed within the specified process window for quality and reliability purposes.”
With the advent of i4.0 and Smart Factory, there has been a great deal of technology put into SMT lines that are manufacturing the very technologies we use today. There has been focus on the front-end and back-end data for the SMT process. Pfluke will discuss the necessity of automatic oven profiling (RPI) and monitoring and the benefits of the data that can be provided in real-time, continuously.
Share on:
Suggested Items
New Version of the Machine Vision Software MVTec MERLIC Focuses on Easier Integration
04/03/2025 | MVTecMachine vision is playing an increasingly important role in the automation of industrial manufacturing processes.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract
04/03/2025 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it is partnering with Raytheon Company, an RTX business, to service a contract for $1.8M from the Air Force Research Laboratory on neuromorphic radar signaling.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.