-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ECA, Inc. Partners with MIRTEC for Continuous Quality Improvement
September 28, 2020 | MIRTEC GmbHEstimated reading time: 2 minutes
MIRTEC, a “Leading Global Supplier” of Technologically Advanced Automated Inspection Systems to the Electronics Manufacturing Industry, is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
“ECA, Inc. is a full-service EMS provider to leading companies in the Aerospace, Military & Defense, Medical, and Industrial Applications Industries. ECA offers a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly. Quality and Service are the key factors to our success. We are a certified ISO 9001 and 13485 company with a documented quality management system, and we insist on continuous improvement. Our MIRTEC MV-3L Desktop AOI system has enabled us to significantly improve our production quality as well as the efficiency of our entire inspection process. MIRTEC’s Technical Support team has been outstanding in providing us with the crucial support necessary for our success. I can honestly say that purchasing a MIRTEC AOI machine is one of the best decisions we have ever made.” Akbal Grewal – Owner and CEO.
“It is truly an honor to be selected by ECA as their AOI Partner,” said Brian D’Amico, President of MIRTEC Corp. “We at MIRTEC are committed to continuous improvement through innovation and strong quality leadership. Ours is a business of precision and accuracy, reproducibility and specificity, timeliness and trust. These are the real products and services which we provide to our valued customers. We look forward to our continued partnership and the mutual success of our two organizations.”
MIRTEC’s Award-Winning MV-3L Desktop 3D AOI Machine is regarded as the industry’s most widely accepted Five Camera Desktop AOI system. This system is configured with an Ultra-High resolution 10 Mega Pixel Top-Down Camera System combined with a Precision Telecentric Compound Lens to provide precision inspection of SMT devices on finished PCB assemblies. Fully configured the MV-3L machines feature four (4) 10 Mega Pixel Side-View Cameras as well as MIRTEC’s exclusive INTELLI-BEAM® Laser System. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. The system is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.