-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ECA, Inc. Partners with MIRTEC for Continuous Quality Improvement
September 28, 2020 | MIRTEC GmbHEstimated reading time: 2 minutes

MIRTEC, a “Leading Global Supplier” of Technologically Advanced Automated Inspection Systems to the Electronics Manufacturing Industry, is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
“ECA, Inc. is a full-service EMS provider to leading companies in the Aerospace, Military & Defense, Medical, and Industrial Applications Industries. ECA offers a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly. Quality and Service are the key factors to our success. We are a certified ISO 9001 and 13485 company with a documented quality management system, and we insist on continuous improvement. Our MIRTEC MV-3L Desktop AOI system has enabled us to significantly improve our production quality as well as the efficiency of our entire inspection process. MIRTEC’s Technical Support team has been outstanding in providing us with the crucial support necessary for our success. I can honestly say that purchasing a MIRTEC AOI machine is one of the best decisions we have ever made.” Akbal Grewal – Owner and CEO.
“It is truly an honor to be selected by ECA as their AOI Partner,” said Brian D’Amico, President of MIRTEC Corp. “We at MIRTEC are committed to continuous improvement through innovation and strong quality leadership. Ours is a business of precision and accuracy, reproducibility and specificity, timeliness and trust. These are the real products and services which we provide to our valued customers. We look forward to our continued partnership and the mutual success of our two organizations.”
MIRTEC’s Award-Winning MV-3L Desktop 3D AOI Machine is regarded as the industry’s most widely accepted Five Camera Desktop AOI system. This system is configured with an Ultra-High resolution 10 Mega Pixel Top-Down Camera System combined with a Precision Telecentric Compound Lens to provide precision inspection of SMT devices on finished PCB assemblies. Fully configured the MV-3L machines feature four (4) 10 Mega Pixel Side-View Cameras as well as MIRTEC’s exclusive INTELLI-BEAM® Laser System. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. The system is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.