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In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Real Time with... SMTAI 2020: First-Day Wrap-Up
September 29, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
SMTA International 2020 kicked off on Monday morning with attendees and exhibitors mingling and chatting about the latest SMT products and services—virtually, of course.
Debbie Carboni, former SMTA VP of Expos, reported that there were “only a few hiccups,” which were addressed quickly and effectively. “This is much better than any other virtual event I have participated in,” she said. “We have received lots of comments on how easy the platform is, even though it is different being virtual.” She also reported that 25% of the registered attendees were new, having never attended an SMTA event before.
Things really heat up on Tuesday, with the Students and Young Professionals Program, the “Virtual Road Trip” Chapter Officers Meeting at noon CT, and an after-hours mixology class and mixer. Don’t forget that you can even win cool prizes like a Peloton bike—just by clicking on various items at booths throughout the show.
The virtual SMTA International Electronics Exhibition runs through September 30. If you haven’t already registered for SMTAI 2020, click here.
Visit Real Time with… SMTAI 2020 and SMT007 now to catch the latest interviews with the SMT industry’s movers and shakers.
Suggested Items
IPC APEX EXPO: Some Thoughts About Growth
05/16/2024 | Dan Feinberg, I-Connect007After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
Using AI to Redefine Productivity
05/15/2024 | Nolan Johnson, SMT007 MagazinePlato Systems, a machine perception company spun out of Stanford University, employs AI and video data to analyze and optimize the human component in manufacturing. Initially focused on semiconductors, Plato Systems has expanded into EMS manufacturing. Co-founder and CEO Amin Arbabian, along with product advisor Anders Holden and head of growth Luis Vidal, discuss their approach to changeover optimization and its impact on productivity in the industry. They’ve also included customer Raj Vora in the conversation.
Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point
05/14/2024 | Real Time with...IPC APEX EXPOIn an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.
DRAM Contract Prices for Q2 Adjusted to a 13–18% Increase
05/07/2024 | TrendForceTrendForce’s latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13–18%, while NAND Flash contract prices have been adjusted to a 15–20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.