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Additive Electronics TechXchange Program Announced
October 6, 2020 | SMTAEstimated reading time: Less than a minute
The SMTA announced speakers from major electronics manufacturers and academia will present research as part of the technical program of the Additive Electronics TechXchange on October 15, 2020. Participating organizations include Auburn University, Duke University, Intel Corporation, Lockheed Martin, Northrop Grumman, and NSWC Crane.
The Additive Electronics TechXchange examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices. This year the event organizers expect to dive deeper into market trends, usage and where additive fits within low, medium and high-volume production for this portion of manufacture where the electronics industry straddles the line between PCB and IC substrate.
Sponsoring companies include AGC Taconic, American Standard Circuits, Inc., Averatek Corporation, Calumet Electronics Corporation, FTG - Firan Technology Group, Insulectro, MacDermid Alpha Electronics Solutions, and SUSS MicroTec. The conference is supported by I-Connect007.
Registration is free for SMTA members and sponsorship opportunities are available. For full details and to register, visit www.smta.org/additive.
To learn more about the conference, including an audio interview with the organizers, click here.
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