Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Road to Reliability: Failures, Monitoring, and Standards on the Path to EV Reliability

08/27/2026 | Stanton Rak, SF Rak Company
Throughout this series, we have examined the technologies, materials, architectures, and environmental challenges that influence the reliability of EV electronics. Yet reliability is ultimately judged in only one place: the field. Customers do not experience qualification reports, design reviews, or accelerated test results. They experience vehicles that either perform as expected or do not. s EV adoption expands globally, the industry has accumulated a growing body of field experience. These lessons reveal both the strengths of current designs and the areas where improvement remains necessary.

Parsons Awarded Position on $14B COMET Missile and Space Intelligence Effort

08/26/2026 | Globe Newswire
Parsons Corporation announced that the company was awarded a position on the Contract Operations for Missile Evaluation and Testing (COMET) contract supporting the Missile & Space Intelligence Center (MSIC) and its mission partners.

Infineon Acquires C2i Semiconductors to Boost AI Data Center Power Solutions

08/24/2026 | Infineon
Infineon Technologies AG announced the acquisition of C2i Semiconductors, a Bangalore-based technology company specializing in software-defined multiphase controllers and smart power stages for AI data center applications.

STMicroelectronics, NUS launch Corporate Lab to power the future of Edge AI in Singapore

08/24/2026 | Globe Newswire
HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation.

Rheinmetall Establishes UK Center for Autonomous Systems

08/19/2026 | Rheinmetall
Rheinmetall is preparing for the next generation of warfare, while delivering world-class technology. To expedite the delivery and meet the demand for autonomous systems, Rheinmetall has opened a new Advanced Land Autonomy Centre of Excellence (ALACOE) in the United Kingdom, enhancing operational effectiveness across the region.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in