Pixelligent Launches PixClear Titania For Ultra High-refractive Index Applications
October 8, 2020 | PixelligentEstimated reading time: 1 minute

Pixelligent, whose PixClear® high-index Designer Compounds™ deliver unparalleled brightness, clarity and operating efficiencies for a broad range of display and optoelectronic applications, announces the launch of PixClear® Titania products. The PixClear® Titania product line, which has applications for Augmented and Virtual Reality, OLED/QD Displays and Optical Sensors, among others, delivers a refractive index range of 1.85 to 2.0+, with transparencies in excess of 95%, at loadings greater than 80 percent.
“PixClear® Titania represents a new class of ultra-high refractive index materials that enables our customers to simultaneously achieve record optical performance and robust mechanical properties – an impossibility until now. PixClear® Titania will deliver dramatic improvements in device efficiency and performance across a broad array of display devices,” said Serpil Gonen Williams, Pixelligent Chief Technology Officer.
“Over the past two years, customers have been asking us to apply our PixClearProcess® to address the ever-increasing index requirements for waveguides, polymer-based photonics, and diffractive-optical elements, among others, and I’m proud to announce that PixClear® TiO2 is now available,” said Craig Bandes, President and CEO of Pixelligent. “We’ve identified 23 metal oxides that can be made using our PixClearProcess® and PixClear® Titania now joins Zirconia in our growing Designer Compounds™ family,” added Bandes.
PixClear® Titania is being offered in 10nm and 20nm capped nanocrystals configurations – both in formulations and as dispersions. PixClear® Titania can be applied using industry standard nanoimprint lithography, inkjet and spin coating processes. Pixelligent has published a white paper detailing further technical specifics about our PixClear® Titania. The white paper – along with information about Pixelligent’s other market-leading high-index materials – is available at www.pixelligent.com.
Suggested Items
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.
Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.