Pixelligent Launches PixClear Titania For Ultra High-refractive Index Applications
October 8, 2020 | PixelligentEstimated reading time: 1 minute
Pixelligent, whose PixClear® high-index Designer Compounds™ deliver unparalleled brightness, clarity and operating efficiencies for a broad range of display and optoelectronic applications, announces the launch of PixClear® Titania products. The PixClear® Titania product line, which has applications for Augmented and Virtual Reality, OLED/QD Displays and Optical Sensors, among others, delivers a refractive index range of 1.85 to 2.0+, with transparencies in excess of 95%, at loadings greater than 80 percent.
“PixClear® Titania represents a new class of ultra-high refractive index materials that enables our customers to simultaneously achieve record optical performance and robust mechanical properties – an impossibility until now. PixClear® Titania will deliver dramatic improvements in device efficiency and performance across a broad array of display devices,” said Serpil Gonen Williams, Pixelligent Chief Technology Officer.
“Over the past two years, customers have been asking us to apply our PixClearProcess® to address the ever-increasing index requirements for waveguides, polymer-based photonics, and diffractive-optical elements, among others, and I’m proud to announce that PixClear® TiO2 is now available,” said Craig Bandes, President and CEO of Pixelligent. “We’ve identified 23 metal oxides that can be made using our PixClearProcess® and PixClear® Titania now joins Zirconia in our growing Designer Compounds™ family,” added Bandes.
PixClear® Titania is being offered in 10nm and 20nm capped nanocrystals configurations – both in formulations and as dispersions. PixClear® Titania can be applied using industry standard nanoimprint lithography, inkjet and spin coating processes. Pixelligent has published a white paper detailing further technical specifics about our PixClear® Titania. The white paper – along with information about Pixelligent’s other market-leading high-index materials – is available at www.pixelligent.com.
Suggested Items
Altair Solutions Now Supported on NVIDIA Grace Hopper and Grace CPU Superchip Architectures
11/22/2024 | AltairAltair, a global leader in computational intelligence, announced that several products from the Altair® HyperWorks® design and simulation platform now support NVIDIA Grace CPU and Grace Hopper Superchip architectures.
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications
11/20/2024 | InfineonInfineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.