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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Just Ask Paul: Automotive and Lead-Free Solders
October 14, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question.
Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.
We hope you enjoy “Just Ask Paul.”
Q: Where is the automotive segment moving as far as adopting generation three lead-free solders?
A: The expanded use of electronics in more sophisticated automotive applications, ranging from advanced safety to powertrain, has led to the continual adoption of high-reliability solder alloys. These multi-part alloys leverage traditional and non-traditional metallurgical techniques to create complex microstructures that enhance creep resistance at higher operating temperatures for improved product lifespan relative to traditional SAC alloys.
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ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
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Indium Experts to Present on Power Electronics at PCIM Europe 2025
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