Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Northrop Grumman: 3D Nanomaterials May Counter Gaps in Additive Supply Chain
October 22, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
The best technology is dead in the water if your domestic supply chain won’t support it. That was just one of the takeaways from Dr. Judy Dickson’s talk during the SMTA Additive Electronics TechXchange.
In her presentation, titled “Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain,” Dickson, a senior principal systems engineer at Northrop Grumman Mission Systems, laid out the many challenges her department faces in fielding HDI advanced packaging into the next decade. Most of these challenges are related to sourcing the necessary materials in the U.S.
Dickson explained how Northrop Grumman qualifies its suppliers. The company sent sourcing assessments to over 30 suppliers to determine their capabilities and capacity gaps, and the results showed a number of gaps in the domestic supply chain.
Much of her session focused on HDI and high-density build-up (HDBU), with HD technology forming a key part of the company’s next-gen RF sensors. Dickson said that HDI allows vias down to .005” to .006” and mixed materials, while HDBU permits 0.002” vias and 0.0015” dielectrics. The interposers used for HDI and HDBU are difficult to source in the U.S.
Northrop Grumman is currently seeking new sources of materials for their next-gen interposers. And the clock is ticking; according to Dickson’s charts, the company’s demand for HDI is slated to almost triple by 2022 and double again by 2026.
The gaps in the supply chain for HDI and HDBU technologies have lead Northrop Grumman’s engineers to look to other options, including 3D-printed nanomaterials. Dickson discussed some of the work focused on this area, and she noted that research is continuing.
Like many U.S. defense firms, Northrop Grumman can develop the most cutting-edge technologies for our warfighters but finding domestic sources for necessary materials is likely to remain a constant struggle. Thanks to Dr. Dickson for shining a spotlight on this important issue.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
08/20/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.
Dymax Renews Connecticut Headquarters Lease, Reinforces Long-Term Commitment to Local Community
08/08/2025 | DymaxDymax, a global manufacturer of rapid light-curing materials and equipment, is pleased to announce the renewal and extension of its corporate lease at its 318 Industrial Lane, Torrington, headquarters.