Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
MacDermid Alpha to Introduce Sintering Products at Step-by-Step Technical Conference
October 28, 2020 | MacDermid Alpha Assembly DivisionEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting an “Introduction to Sintering Products” at the Step-by-Step Technical Conference on Thursday, November 5, 2020 in Hangzhou, China.
Due to the increasing demand of silver sintering technology in the industry, MacDermid Alpha was invited to introduce sintering products at this technical conference. Most advanced electric vehicles are now using silver sinter technology to enable increased efficiency (lower power loss by thermal dissipation), improved peak performance (managing transients at high torque situations) and improved reliability (10-15X fold improvement in power cycling). During the conference, MacDermid Alpha will cover topics including the basics of silver sintering and silver sintering for EV traction inverters.
William Yu, Senior Technical Service Manager at MacDermid Alpha Electronics Solutions, will be presenting the paper at 09:10am on Thursday, November 5th at Crowne Plaza Hangzhou. For more information on MacDermid Alpha’s Power Electronics and Assembly Solutions, visit MacDermidAlpha.com
Step-by-Step Technical Conference, Hangzhou
Date: Nov 5, 2020 (Thursday)
Time: 9:10am - 9:40am
Venue: Crowne Plaza Hangzhou HEDA, No.523 Jinsha Avenue, HEDA, Hangzhou, 310018, China
Topic: Sintering Products Introduction
Speaker: William Yu, Senior Technical Service Manager, Assembly Solutions
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA
05/12/2026 | Green CircuitsGreen Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.
Fabrinet Announces Q3 Fiscal Year 2026 Financial Results
05/11/2026 | FabrinetFabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its third fiscal quarter ended March 27, 2026.
IMI Reports Q1 2026 Results, Delivering Higher Profitability and Stable YoY Revenue
05/11/2026 | IMIIntegrated Micro-Electronics, Inc. (IMI), a global electronics manufacturing services provider, announced financial results of the first quarter of 2026 highlighting improved profitability and margin expansion, underscoring the effectiveness of its ongoing transformation initiatives despite pockets of market softness in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.