-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
ScoutCam Receives U.S. Patent Allowance for PCBs in Camera Technology
October 29, 2020 | Globe NewswireEstimated reading time: 1 minute

Medigus Ltd. a technology company engaged in advanced medical solutions and innovative internet technologies, announced it was informed that ScoutCam Inc. Medigus’ affiliate company and a leading developer and manufacturer of customized micro visual solutions and supplementary technologies, received a patent notice of allowance by the United States Patent and Trademark Office, covering, among other things, ScoutCam’s innovative design of Printed Circuit Boards (PCBs), which is included in the camera head. This technology covered by the notice would enable ScoutCam to design and manufacture smaller scale cameras than its competitors per given sensor.
ScoutCam used this technology for the design of its second-generation camera for NASA, which was used in-orbit during its third Robotic Refueling Mission (RRM3) on October 19th-22nd, 2020.
The unique technology enabled the Company to be selected at the United States Government's international tender bid for the design and production of this camera. In addition to its miniature size, the versatile micro ScoutCam 8.0 HD camera features state of the art customizable optics and noteworthy image quality.
Furthermore, the ability to down scale the camera's diameter carries distinct benefits in the medical device context, in which minimizing an object upon entry into the body - in this case the camera - provides a vital advantage. ScoutCam intends to use this technology to further develop and sell cameras to medical device manufacturers, especially for disposable endoscopes – a market that conducts approximately 75 million endoscopies each year in the U.S. alone – as well as for minimally invasive surgical endoscopic procedures that afford even higher margins.
“As we are engaged in designing and manufacturing innovative novel products, a strong IP portfolio is essential. This notice of allowance for the patent further strengthens our broad IP portfolio. We see this approval as another testimony to our innovation as well as the acceptance we witness by industry leaders, such as NASA and others," said Yaron Silberman, PhD MBA, Chief Executive Officer of ScoutCam.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.