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What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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StaticStop Now Offers SelecTile ESD Flooring in Gray
October 29, 2020 | StaticStopEstimated reading time: 1 minute
StaticStop, a division of SelecTech, Inc., and leader in the manufacture of innovative ESD flooring products that save time and money, now offers its SelecTile ESD™ flooring in gray. SelecTile ESD™ is the most durable, resilient, and portable ESD flooring product available. The flooring can be installed with no downtime, no prep, and can even be installed over carpet.
SelecTile ESD™ flooring is a free-floating surface with a unique interlocking tab system. These static-control flooring products install quickly and easily without the need for adhesives, copper strips, underlayments or padding. SelecTech’s static-control systems were uniquely engineered to meet the demanding needs of industrial environments that require the highest level of electrostatic discharge protection, and still withstand industrial environments, including fork truck traffic.
SelecTile ESD™ is made with a minimum of 20% recycled materials, and is the only ESD conductive flooring of its kind that can contribute to LEED™ Credits.
Recently, all SelecTech’s ESD flooring tiles were tested by the same company that NASA uses for testing. Both FreeStyle ESD and SelecTile ESD passed with excellent results. This reiterates that SelecTech’s flooring provides the most stringent ESD protection even for the most sensitive environments including high-reliability device manufacturers. SelecTile ESD tiles also meet all ANSI 20.20 standards.
Suggested Items
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.