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StaticStop Now Offers SelecTile ESD Flooring in Gray
October 29, 2020 | StaticStopEstimated reading time: 1 minute
StaticStop, a division of SelecTech, Inc., and leader in the manufacture of innovative ESD flooring products that save time and money, now offers its SelecTile ESD™ flooring in gray. SelecTile ESD™ is the most durable, resilient, and portable ESD flooring product available. The flooring can be installed with no downtime, no prep, and can even be installed over carpet.
SelecTile ESD™ flooring is a free-floating surface with a unique interlocking tab system. These static-control flooring products install quickly and easily without the need for adhesives, copper strips, underlayments or padding. SelecTech’s static-control systems were uniquely engineered to meet the demanding needs of industrial environments that require the highest level of electrostatic discharge protection, and still withstand industrial environments, including fork truck traffic.
SelecTile ESD™ is made with a minimum of 20% recycled materials, and is the only ESD conductive flooring of its kind that can contribute to LEED™ Credits.
Recently, all SelecTech’s ESD flooring tiles were tested by the same company that NASA uses for testing. Both FreeStyle ESD and SelecTile ESD passed with excellent results. This reiterates that SelecTech’s flooring provides the most stringent ESD protection even for the most sensitive environments including high-reliability device manufacturers. SelecTile ESD tiles also meet all ANSI 20.20 standards.
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10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.