-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Z-AXIS Invests in Through-Hole and Mixed-Technology PCB Assembly
November 4, 2020 | Z-AXISEstimated reading time: 1 minute
Z-AXIS, Inc. has upgraded and expanded its production lines for through-hole and mixed-technology printed circuit board (PCB) assembly at its contract design and manufacturing center near Rochester, NY.
The newly-revamped production line features 30-foot adjustable extruded aluminum board handling rails, custom LED task lighting, CAM software with electronic assembly instructions for each station, and a conveyor to transport boards through inspection after wave solder and depaneling.
The upgraded production line supports a single-piece flow of PCB assemblies through component insertion, wave solder, in-line inspection, depaneling, QC, testing, and burn-in. Single-piece flow is an alternative to the common practice of running batches of boards through the individual steps, sometimes days apart. Single-piece flow allows Z-AXIS to note and implement corrections or process improvements immediately, rather than on future batches.
Through-hole components are essential in many electronic products, such as high-power boards.
“At Z-AXIS, nearly 75% of the boards we run are mixed-technology, with both through-hole and surface mount technology (SMT) components,” said Michael Allen, President of Z-AXIS. “While many contract manufacturers consider through-hole assembly to be a distraction from their SMT business, we continue to invest in both areas. This enables us to produce mixed-technology PCB assemblies, at reasonable cost and high quality, in the USA.”
Earlier this year, the company announced a million-dollar investment in SMT assembly equipment, creating two identical high-speed, high-mix SMT lines and a separate SMT new product introduction (NPI) line.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.