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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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EIPC Announces Technical Snapshots
November 5, 2020 | EIPCEstimated reading time: 1 minute
EIPC will hold a webinar at which three very reassuring gentlemen will help matters become a little clearer.
In the 45-minute session, moderated by our Chairman Alun Morgan, we will hear from;
Dr. SHIUH-KAO CHIANG, Prismark, who will show how the pandemic has substantially distorted PCB production patterns and demand expectations. He will reflect on the 2020 PCB market and discuss the various key factors that drive or alter the market momentum.
Prismark Abstract: 2020 is a year to remember. This is probably the first time that the global electronics and PCB industries are deeply impacted by an infectious disease. Furthermore, the pandemic has substantially distorted PCB production patterns and demand expectations. As a result, the 2020 PCB market is very different from originally anticipated. In this presentation, Prismark will present its views on the 2020 PCB market and discuss the various key factors that drive or alter the market momentum.
Mike Vinson, Averatek, will look at how the availability of thinner high-performance materials brings many advantages to board layout and design without affecting impedance requirements.
Averatek Abstract: The trace size on today’s high speed circuits are often limited by impedance matching and dielectric thickness. Semi-Additive PCB fabrication enabling smaller, more accurate traces with straighter more precise trace sidewalls in combination with the availability of thinner high-performance materials bring many advantages to board layout and design without affecting impedance requirements. This presentation will discuss the A-SAP™ process and its impact on signal integrity and PCB design.
Roland Herold, Atotech, will underline the importance of reliability when plating electrolytic stacked blind micro vias (BMVs), and give an overview about the latest findings & developments in electrolytic copper.
Atotech Abstract: The continuously increasing thermo-mechanic reliability requirements for e.g. automotive electronics and 5G hand-held PCBs needs a better understanding of all production processes.
Apart from the contribution of the well-known factors like base material properties, pressing/lamination & drilling conditions, de-smearing & deposition parameter of the conductive seed layer, the set-up of the electrolytic copper process plays an important role in advanced interface reliability between stacked micro-vias.
The webinar introduces into the gives an overview about the latest findings & developments in electrolytic copper.
There will be a Q&A session after the last speaker. Free for EIPC members and a charge for non-members.
Suggested Items
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.
PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.