Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
IMI, Inc. Earns IPC-1791 Listing After Intensive Audit
November 13, 2020 | IPCEstimated reading time: 1 minute
IMI, Inc., a specialty fabricator of printed circuit boards and substrates based in Haverhill, Mass., has successfully completed an intensive audit to IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements and has earned a Qualified Manufacturer’s Listing (QML) under IPC’s Validation Services program.
Requirements for certification and QML listing to IPC-1791 includes: product and quality system, supply chain risk management system (SCRM), security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC) review.
Peter Bigelow, IMI, Inc. president and CEO said, “Realizing the critical importance of protecting our customer’s Intellectual Property (IP), IMI began the process toward certification five years ago by retaining IT and security services firm Neoscope Technology Solutions to perform a review of out IT and security infrastructure and protocols with an eye toward full compliance to NIST SP 800-171.
“From Neoscope’s review, we put together a gap analysis and action plan and committed the resources -- financial and staff -- to meet and exceed all requirements,” Bigelow added. “Certification to IPC-1791, which incorporates NIST-SP 800-171 Rev. 2 confirms that IMI has successfully put in place robust and effective cyber, physical and chain-of-control protocols to assure our customers’ critical IP is secure. IMI is proud to have achieved the distinction of being the fourth circuit board fabricator to be certified as a trusted supplier under IPC’s stringent Validation Services program.”
“We are pleased to recognize IMI’s QML,” said Randy Cherry, IPC director of Validation Services. “This accreditation has earned them a spot on IPC’s global network of rigorously vetted, trusted sources, giving them an edge on their competition.”
For more information about IPC's Validation Services QML/QPL program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.