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Amtech Reports Record Sales for Advanced Packaging Reflow Systems
November 20, 2020 | Amtech Systems, Inc.Estimated reading time: 1 minute
Amtech Systems, Inc., a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), announced that its subsidiary, BTU International, Inc., achieved record sales for its PYRAMAX™ reflow systems sold into advanced packaging applications in fiscal year ending September 30, 2020.
These sales include PYRAMAX convection reflow ovens and PYRAMAX TrueFlat convection reflow ovens. BTU achieved 20% year-over-year growth within the segment, as well as the addition of a number of new key advanced packaging customers across multiple regions.
“In fiscal 2020, our customer base for Pyramax TrueFlat expanded from geographically concentrated OSATs to new entrants in multiple regions,” said Michael Whang, Chief Executive Officer of Amtech. “TrueFlat demonstrates how we have used our technology to solve customer problems and illustrates its effectiveness as a key enabling technology for the industry. These achievements highlight Amtech’s commitment to achieve growth through focused product development in high growth areas of our industry,” added Mr. Whang.
Designed for very thin substrates of 0.15mm to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the PYRAMAX’s closed-loop convection heating. The PYRAMAX with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes.
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