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Würth Elektronik Switching to More Sustainable Packaging
November 27, 2020 | Wurth ElektronikEstimated reading time: 1 minute
Logistics at one of Europe’s biggest manufacturers of electronic and electromechanical components has declared war on packaging waste. Würth Elektronik is putting all goods packaging processes to the test. The internal goals: drastic reduction of plastics and a switch to more sustainable materials.
Many waste-reducing measures have already been realized or are being implemented: For example, Würth Elektronik's Logistics only uses filling material based on recycled paper and also minimizes consumption by using hold-down devices and separating boxes. Padded envelopes are plastic-free, paper-based parcel tape holds parcels together where necessary, and boxes with lids save on adhesive tape. Plastic bags are being replaced by parchment paper bags on a large scale, for example for the delivery documents on the outside of parcels.
On the occasion of the European Week for Waste Reduction (Nov. 21-29, 2020) says Georgios Stamos, Head of Logistics in Waldenburg, Environmental Officer in Logistics at Würth Elektronik eiSos: "According to the German Federal Environment Agency, per capita packaging consumption has increased by 17.9 percent since 2010. Of this, more than half is caused by industry and commerce. So we are looking closely where we can become more sustainable. We are currently evaluating cardboard boxes that consist of up to 50 percent grass. In doing so, we are facing up to special requirements: Because we, as a developer service provider, offer free samples and design kits with replenishment, and this makes for a large number of small shipments. This service should be maintained, of course, but will be provided more sustainably in the future. Both here and elsewhere, protecting our environment involves a multitude of coordinated steps, which come with costs for the company. But the reduction of packaging waste is a responsibility that we as the workforce and company are happy to accept with great commitment.”
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Coastal RF Systems Joins StratEdge’s Network as Manufacturer’s Representative for Southern California
10/31/2024 | StratEdgeStratEdge Corporation, a leader in high-performance semiconductor packaging solutions, has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.