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GETECH Launches Largest Fixtureless PCB Router Available Today
November 27, 2020 | Getech Automation Pte Ltd.Estimated reading time: 1 minute
Getech Automation launches the latest in its family of inline automated Depanelling machines based on the GBR platform.
The Getech Bottom Router has proven its utility not just as a PCB Depanelling system but as a point of work balance acting as a cutting system, a handling system, a sorting system and all the while keeping the demand for operators to a minimum. As the world of electronics permeates our lives, the demand for miniaturization, smaller and faster is being complimented by larger and longer form factor panels that exceed the norms of manufacture. Many EV and Solar applications have resulted in larger form factor electronics with the opposite in extreme dimensions. To meet this need Getech launches the BBR – imaginatively titled as the ‘Big Bottom Router’.
Unlike many machines designed for large format PCBs the BBR is the only one that uses a multi stage robotic gripping system to handle the PCB. This means the need for Large, Heavy and cumbersome fixtures is removed. No Fixtures Required !!! The BBR can accommodate PCBs unto 1200mm in length. The multi stage handling means the gripper is positioned at the point closest to the cutting location maintaining PCB stability and minimizing any movement during cutting. An under PCB support mechanism stops the PCB from “Sagging under its own weight” and the output flat belt is stretched to accommodate the total PCB length.
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SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic-Hesselink, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
Protecting Advanced Trucking Electronics in Harsh Environments
05/13/2026 | Beth Massey, MacDermid Alpha Electronics SolutionsFor decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.