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SHENMAO Introduces New Joint-Enhanced Solder Paste Series
November 30, 2020 | SHENMAO America, Inc.Estimated reading time: Less than a minute
SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
The residue from the PF606-EP Series provides excellent bonding strength and joint protection, thus enhancing joint reliability. JEP is compatible with various surface finishes. Additionally, the no-clean paste leaves a transparent residue; ensuring luminous flux is unaffected for LED die attach applications.
“The new paste enables our customers to perform one-step reflow for soldering and joint enhancement," stated Watson Tseng, General Manager of SHENMAO America.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
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