Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Rehm Develops Soldering System Under Cleanroom Conditions
December 2, 2020 | Rehm Thermal SystemsEstimated reading time: 2 minutes
With VisionX Semico, Rehm Thermal Systems developed a system that was adapted to the special requirements of the semiconductor market segment. It is based on the proven Vision series, which has been successfully established in the reflow soldering market for years. Especially important for the development of the VisionX Semico was the compliance with all specifications for the use of the system under clean room conditions. The VisionX Semico is certified for clean room class 1000 and designed for high throughput. Optimal heat transfer through specially developed nozzle arrays ensures a small delta T and thus the best process performance.
The low-vibration transport, whether designed as braided tape, pin chain or combined transport, and as single lane or dual lane, meets the high demands of semiconductor production and ensures additional process reliability. A particular advantage of the system is the flexible configuration of the cooling line. Here, the components in the respective zones can be supplied with either cold air or warm air. A combination of cold air above, warm air below or vice versa is also possible. This enables gentle, stress-free cooling of components and guarantees flexible outlet temperatures.
The development of the VisionX Semico naturally also focused on energy efficiency and ease of maintenance. The system is equipped with particularly high-quality insulation which meets the requirements of the cleanroom class and ensures maximum energy efficiency within the process chamber. Pyrolysis is integrated as standard for reliable cleaning of the process air. This pyrolysis ensures a dry and clean process chamber and compliance with the exhaust air specifications for cleanroom concepts and requires maintenance only once a year. In addition, a condensate trap is installed as standard in the cooling track, which reliably separates the crystalline residues and ensures simple maintenance and extended maintenance cycles. The technical design of the system, paired with innovative, modern software, is decisive in ensuring that the VisionX Semico is optimally equipped for all current and future SECS / GEM / Industry 4.0 / MES solutions.
With the VisionX Semico, Rehm has developed a system that is optimally designed for the production of components under cleanroom conditions and has once again shown that all areas of thermal systems are well within the company’s territory.
About Rehm Thermal System
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with 30 years of industry experience, we implement innovative manufacturing solutions that set standards.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.