-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Lorain County Community College’s Successful MEMS Program
December 7, 2020 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes

The I-Connect007 editorial team had the pleasure of an extended and detailed conversation with Johnny Vanderford and Courtney Tenhover from Lorain County Community College (LCCC). Vanderford and Tenhover are at the heart of the microelectromechanical systems (MEMS) program at LCCC that is emerging as a model for a successful technical higher-education program. This conversation was lively, and the enthusiasm at LCCC is infectious, as it should be; their results are impressive.
Nolan Johnson: Can you please introduce who you are and what you do?
Johnny Vanderford: I’m an assistant professor and coordinator of the MEMS program at LCCC. I am also the director of LCCC’s new Manufacturing Electronics and Rework Institute for Training (MERIT). The content of our degree and institute is primarily focused on training with hands-on skills in electronics manufacturing.
Johnson: We need a lot of that in this industry.
Vanderford: I couldn’t agree more.
Courtney Tenhover: I’m a program developer at LCCC. I work on the earn-and-learn side of the program with Johnny, including getting job placements for students, working with employers to understand their needs, and pairing students and employers together. I have an HR and project management background, so bringing that to this program helps me work with employers on the HR side. Johnny is the technical expert.
Vanderford: My background is in electrical engineering. I have a master’s degree from Northern Illinois University. A primary part of my degree is based on electronic materials and hybrid board manufacturing, including a variety of different types of PCBs. The degree we teach is microelectronics manufacturing. It’s how PCBs are manufactured, assembled, repaired, reworked, and designed with some additional skills in microelectronic packaging, such as wire bonding, die attach, and even a little bit of some chemical fabrication of silicon wafers and PCBs.
The degree is heavily focused on career placement in electronics manufacturing. It is designed to be a workforce generator to help fill the pipeline. We require every student in our program to have accumulated 600 hours of paid workforce experience, or the student doesn’t get their degree, and the community college won’t get state share of instruction (i.e., additional funding for continuing) for helping students get degrees. We all know someone who has a degree in one thing, but they’re working in a completely separate field. We have tailored the program using input and feedback from our industry supporters so that we can train students in necessary electronics manufacturing skills, such as hand soldering, hot air rework, loading pick-and-place systems, and stencil printers with solder paste.
Students can get trained at the college while they’re taking classes, and they get employed at companies working part-time from one to three years while they continue toward their bachelor’s degree. My role is to give them the technical content, and Courtney’s role is to connect the students with the companies on an HR level. When we go to companies, I talk engineering with engineers. Courtney finds out what the job needs are, gets those job requests to our students and alumni, gathers the resumes of those interested students and alumni, and sends them back to the company’s HR line. That way, the engineers tailor the technical content to the program, and the company has a steady flow of workforce that is ready to begin working.
To read this entire interview, which originally appeared in the December 2020 issue of SMT007 Magazine, click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.