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Eltek Continues to Invest, Increase Production Capacity
December 9, 2020 | EltekEstimated reading time: 1 minute

Eltek is excited to announce the new custom-built DES (Develop/Etch/Strip) line, for faster, more precise, and fully Industry 4.0 compliant production line.
All DES modules can be controlled and monitored independently with mobile terminal devices such as tablets or via web browser which improves process control and stability. The new Eltek DES Line can be directly connected to the production monitoring system which ensures traceability of inner layers. The specially designed conveyor enables Eltek to be able to process ultra-thin flex cores and will increase production capacity and yields.
The new DES line etching module was designed particularly for fine line etching which allows Eltek to reach 2 mil Line Space (L/S) and beyond for ultra-thin & high-density PCBs.
Eltek’s new DES line is designed for low power usage and high performance (IE4), reduced chemical consumption and lower environmental pollutant discharge for complete compliance to environmental regulations.
The company is confident that with this new DES line, and Eltek’s continuous investments in our production lines our customers will benefit from enhanced capabilities and leadtimes.
The new DES line is now undergoing testing and certification. It is operating in parallel with the former DES line to maintain full production capacity.
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American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/04/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Talking with Tamara: Floor Planning Policies
09/04/2025 | Andy Shaughnessy, Design007 MagazineTamara Jovanovic is an electrical engineer with Masimo, a medical equipment manufacturer. She’s been designing PCBs for seven years and earned a master’s degree in electrical engineering in 2022. I asked Tamara to share her thoughts on floor planning—the challenges, techniques, and advice for designers setting up floor planning strategies.