-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
MKS Expands Industry Footprint in Asia with Newest HDI PCB Laser Manufacturing Solution
December 10, 2020 | MKS Instruments, Inc.Estimated reading time: 2 minutes
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, announced it has received an order for multiple ESI® Geode™ HDI via drilling systems in Taiwan from a major technology leader in the HDI PCB manufacturing market.
“The market is embracing the economic advantages that the latest MKS developments have to offer,” said John Williams, Vice President and General Manager of MKS’ Equipment and Solutions division. “Our Geode HDI via drilling system meets the needs of high-volume HDI PCB manufacturing, while helping customers secure a technological advantage for current and future product requirements.”
This multi-unit order will support the customer’s existing manufacturing and future technological development through the use of leading-edge via drilling technology. Since its release to the market, the Geode HDI via drilling system has introduced HDI manufacturers to the performance advantages that ESI technology has provided to Flex PCB manufacturers for decades. The Geode platform has seen strong traction amongst the industry’s top players since its recent introduction to the market.
Developed by MKS’ Equipment & Solutions Division, already a market leader in flex PCB laser drilling solutions, the Geode system is optimized to process the rigid HDI PCBs and package substrates widely used in consumer electronics, such as smartphones and other handheld devices. Building on MKS’ technology leadership in laser processing for flexible printed circuits, Geode’s new laser technology and control capabilities deliver breakthrough performance. Its superior throughput, refined power control and small system footprint meet the needs of high-volume PCB manufacturers and technology leaders.
About MKS Instruments
MKS Instruments, Inc. is a global provider of instruments, systems, subsystems and process control solutions that measure, monitor, deliver, analyze, power and control critical parameters of advanced manufacturing processes to improve process performance and productivity for our customers. Our products are derived from our core competencies in pressure measurement and control, flow measurement and control, gas and vapor delivery, gas composition analysis, electronic control technology, reactive gas generation and delivery, power generation and delivery, vacuum technology, lasers, photonics, optics, precision motion control, vibration control and laser-based manufacturing systems solutions. We also provide services relating to the maintenance and repair of our products, installation services and training. Our primary served markets include semiconductor, industrial technologies, life and health sciences, research and defense. Additional information can be found at www.mksinst.com.
About the ESI Brand
ESI® is a brand within the MKS Instruments Equipment & Solutions Division. The ESI portfolio consists of laser-based micro manufacturing systems and component test systems that are used worldwide by manufacturers in the electronics industry to process the materials and components that are an integral part of the electronic devices and systems in use today. Leveraging over 40 years of laser-material interaction expertise and applied laser technology, ESI solutions enable customers to optimize production by providing more control, greater application flexibility and more precise processing of a wide range of materials. The result is higher production quality, increased throughput and higher back-end yields at a lower total cost-of-ownership. Additional information can be found at www.esi.com.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
All Flex Solutions Hires Mike Madetzke as Manager of R&D
05/08/2024 | All Flex SolutionsAll Flex Solutions is very pleased to announce that Mike Madetzke has joined their team as their new Manager of Research and Development.
Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
America Projected to Triple Semiconductor Manufacturing Capacity by 2032, the Largest Rate of Growth in the World
05/08/2024 | SIAThe Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), released a report on the global chip supply chain that projects the United States will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032.
Coherix Partners with EMU on 'Factory of the Future' Technology Program
05/08/2024 | PRNewswireMichigan-based Coherix is working with Eastern Michigan University (EMU) in Ypsilanti to develop "factory-of-the-future" manufacturing and assembly technology.