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Mentor to Officially Change Name to Siemens EDA
December 14, 2020 | Siemens EDAEstimated reading time: Less than a minute
Mentor, a Siemens business, will be known as Siemens EDA as of January 2021. The organization continues to operate as part of Siemens Digital Industries Software.
Under this new banner, Siemens is bringing together the world’s most comprehensive portfolio of EDA software, with Siemens technology for simulation, mechanical design, manufacturing, cloud, IoT and low-code.
The result is the broadest and deepest portfolio of industrial software that is uniquely positioned to help customers successfully navigate the accelerating convergence of semiconductor design and systems design.
For more information about this change, be sure to read this blog post by Joseph Sawicki, Executive Vice President of IC-EDA for Siemens EDA.
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IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.