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Technica Hosts In-House Visit from PCBAA

10/01/2025 | Technica USA
David Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A. 

Global Sourcing Spotlight: Finding the Balance Between Cost and Quality

09/24/2025 | Bob Duke -- Column: Global Sourcing Spotlight
In global sourcing, pursuing lower costs often takes center stage. It’s the shiny lure that gets buyers to cast their lines into unfamiliar waters. But seasoned professionals know that in the long run, sourcing is less about price tags and more about value. The real magic—and margin—lies in finding the balance between cost and quality.

Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide

08/20/2025 | Bob Duke -- Column: Global Sourcing Spotlight
In global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.

August 2025 PCB Magazine: Inventing the Future With SEL

08/18/2025 | I-Connect007 Editorial Team
Two years after launching its state-of-the-art PCB facility, Schweitzer Engineering Laboratories shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication. The August 2025 issue of PCB007 Magazine takes you inside the facility to hear from its founder, Dr. Ed Schweitzer, its manufacturing team leaders, and several of the supplier vendors that make this a cutting-edge fabrication plant.

Materials and Manufacturing for the AI Era: The Next PCB Frontier

08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial Team
AI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards,  expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
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