Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Cogiscan Expands Strategic Partnership with ASM
December 18, 2020 | CogiscanEstimated reading time: 1 minute
Cogiscan, the leading provider of Track, Trace and Control (TTC) & IIoT solutions for the electronics manufacturing industry, is excited to announce an expansion of its existing strategic partnership with ASM Assembly Systems to include new machine connectivity solutions to support Industry 4.0 initiatives. ASM’s world-class equipment for printing, SPI and placement coupled with its leading software solutions for operator pooling and SMT process optimization will be enhanced by the addition of Cogiscan’s Co-NECT data collection platform for integration with enterprise software systems.
This collaboration will extend ASM’s system integration capabilities by providing out-of-the-box software interfaces using the IPC CFX protocol for machine communication. Customers who require this protocol as part of their factory digitalization efforts will benefit by having plug-and-play adapters for quickly integrating their ASM equipment with their MES or other systems.
“We’ve been fortunate to have had a strong and successful partnership with ASM for many years now,” says Mitch DeCaire, Director of Business Development at Cogiscan. “We are delighted to be able to build on that mutual success and extend our partnership even further to help ASM deliver more value for their customers."
“We are very happy to further our partnership with Cogiscan,” says Dr. Thomas Marktscheffel, Director SW-Integration Platform at ASM. “With factory digitalization becoming a must for electronics manufacturers, we believe the addition of Cogiscan’s system integration solution for the emerging CFX standard will enhance our offering around Smart Factory solutions.”
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.